Invention Grant
- Patent Title: RF-isolating sealing enclosure and interconnection junctions protected thereby
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Application No.: US14697255Application Date: 2015-04-27
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Publication No.: US09653852B2Publication Date: 2017-05-16
- Inventor: David J. Smentek , Michael Guerin
- Applicant: CommScope Technologies LLC
- Applicant Address: US NC Hickory
- Assignee: CommScope Technologies LLC
- Current Assignee: CommScope Technologies LLC
- Current Assignee Address: US NC Hickory
- Agency: Myers Bigel, P.A.
- Main IPC: H01R13/52
- IPC: H01R13/52 ; H01R13/6599 ; H01R13/6592 ; H01R9/05 ; H01F38/14 ; H02G15/18 ; H02G15/08
Abstract:
An interconnection junction for communications cables includes: a first connector; a second connector; and a sealing enclosure having a cavity and formed of a polymeric material, the sealing enclosure comprising an RF-isolating material. The first connector and second connector are joined and reside within the cavity of the sealing enclosure.
Public/Granted literature
- US20150333452A1 RF-ISOLATING SEALING ENCLOSURE AND INTERCONNECTION JUNCTIONS PROTECTED THEREBY Public/Granted day:2015-11-19
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