Invention Grant
- Patent Title: Ground contact of an integrated circuit testing apparatus
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Application No.: US13848209Application Date: 2013-03-21
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Publication No.: US09658248B2Publication Date: 2017-05-23
- Inventor: Foong Wei Kuong , Goh Kok Sing , Shamal Mundiyath
- Applicant: JF Microtechnology Sdn. Bhd.
- Applicant Address: MY Petaling Jaya
- Assignee: JF MICROTECHNOLOGY SDN. BHD.
- Current Assignee: JF MICROTECHNOLOGY SDN. BHD.
- Current Assignee Address: MY Petaling Jaya
- Agency: Maschoff Brennan
- Priority: MYPI2012004588 20121012
- Main IPC: G01R1/067
- IPC: G01R1/067 ; G01R1/04

Abstract:
A ground electrical contact for an integrated circuit (IC) testing apparatus that comprises: a rigid bottom member having two planar surfaces that slope towards each other, so that the bottom member forms a partial wedge shape with the top end of the wedge being narrower than the bottom end; a flexible top member having two arms extending over said bottom member such that the top member forms an inverted U-shape, said two arms having an inwards bias such that an inner surface of each arm is pressed in contact with each planar surface; and a compressible member located between the narrower end of said bottom member and a bifurcation inner surface, which is an inner surface where the two arms bifurcate in the top member. The bottom member and top member are made of an electrically conductive material.
Public/Granted literature
- US20140103952A1 GROUND CONTACT OF AN INTEGRATED CIRCUIT TESTING APPARATUS Public/Granted day:2014-04-17
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