Invention Grant
- Patent Title: Integrated circuit packaging system with interposer structure and method of manufacture thereof
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Application No.: US15167895Application Date: 2016-05-27
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Publication No.: US09659897B1Publication Date: 2017-05-23
- Inventor: Zigmund Ramirez Camacho , Emmanuel Espiritu , Bartholomew Liao Chung Foh , Dao Nguyen Phu Cuong , Jeffrey David Punzalan
- Applicant: STATS ChipPAC Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Pte. Ltd.
- Current Assignee: STATS ChipPAC Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Wong & Rees LLP
- Agent Kirk D. Wong
- Main IPC: H01L23/22
- IPC: H01L23/22 ; H01L23/24 ; H01L23/00 ; H01L23/31 ; H01L23/522
Abstract:
A system and a method of manufacture thereof of integrated circuit packaging system, including: a pillar; a conductive buildup attached to the pillar; and a molded body encapsulating the conductive buildup, the pillar extending out of the molded body.
Information query
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