公开(公告)号：US09659897B1

公开(公告)日：2017-05-23

申请号：US15167895

申请日：2016-05-27

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Zigmund Ramirez Camacho ,  Emmanuel Espiritu ,  Bartholomew Liao Chung Foh ,  Dao Nguyen Phu Cuong ,  Jeffrey David Punzalan

IPC: H01L23/22 ,  H01L23/24 ,  H01L23/00 ,  H01L23/31 ,  H01L23/522

CPC classification number: H01L24/25 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5226 ,  H01L23/562 ,  H01L24/17 ,  H01L25/04 ,  H01L2224/16225 ,  H01L2224/1701 ,  H01L2224/2501 ,  H01L2224/2505 ,  H01L2924/15311 ,  H01L2924/1533

Abstract: A system and a method of manufacture thereof of integrated circuit packaging system, including: a pillar; a conductive buildup attached to the pillar; and a molded body encapsulating the conductive buildup, the pillar extending out of the molded body.

公开(公告)号：US10109587B1

公开(公告)日：2018-10-23

申请号：US15226735

申请日：2016-08-02

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Dao Nguyen Phu Cuong ,  Bartholomew Liao Chung Foh ,  Byung Tai Do ,  Kyung Moon Kim ,  Jeffrey David Punzalan ,  SeungYong Chai ,  Soo Won Lee ,  Kwok Keung Szeto ,  KyungOe Kim

IPC: H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L21/768

Abstract: An integrated circuit packaging system, and a method of manufacture thereof, including: a substrate including: a first trace layer, an encapsulation on the first trace layer, the first trace layer having a surface exposed from the encapsulation with a rough texture characteristic of removal of a conductive carrier coating, a second trace layer on the encapsulation and over the first trace layer, the second trace layer connected to the first trace layer; and an integrated circuit die attached to the substrate.