Invention Grant
- Patent Title: Double side mounting memory integration in thin low warpage fanout package
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Application No.: US14680539Application Date: 2015-04-07
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Publication No.: US09659907B2Publication Date: 2017-05-23
- Inventor: Jun Zhai , Kunzhong Hu , Chonghua Zhong , Mengzhi Pang , Se Young Yang
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L25/065 ; H01L21/56 ; H01L23/538 ; H01L23/00 ; H01L25/00
Abstract:
Packages and methods of formation are described. In an embodiment, a package includes a redistribution layer (RDL) formed directly on a top die, and a bottom die mounted on a back surface of the RDL.
Public/Granted literature
- US20160300813A1 DOUBLE SIDE MOUNTING MEMORY INTEGRATION IN THIN LOW WARPAGE FANOUT PACKAGE Public/Granted day:2016-10-13
Information query
IPC分类:
