Invention Grant
- Patent Title: Chip inductor
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Application No.: US14981679Application Date: 2015-12-28
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Publication No.: US09660013B2Publication Date: 2017-05-23
- Inventor: Hwan Soo Lee , Hye Yeon Cha , Jung Min Park , Kang Heon Hur , Moon Soo Park
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2012-0058289 20120531
- Main IPC: H01L27/08
- IPC: H01L27/08 ; H01L49/02 ; H01F27/24 ; H01F27/255 ; H01F27/28 ; H01F27/29

Abstract:
Disclosed herein is a chip inductor. The chip inductor according to the present invention includes a substrate on which a trough-hole is formed, a conductive coil that is formed on the substrate, an upper resin composite magnetic layer that is filled to surround the conductive coil so that a core is formed on a center portion of the substrate, a lower resin composite magnetic layer that is formed on a bottom portion of the substrate, and an external electrode that is formed on both sides of the upper and lower resin composite magnetic layers.
Public/Granted literature
- US20160118178A1 CHIP INDUCTOR Public/Granted day:2016-04-28
Information query
IPC分类: