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16 条记录 (耗时 0.019 秒)

    Multilayer capacitor
    2.
    发明授权
    Multilayer capacitor 有权

    公开(公告)号：US11264173B2

    公开(公告)日：2022-03-01

    申请号：US16562824

    申请日：2019-09-06

    申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

    发明人： So Ra Kang ,  Jung Min Park ,  Byeong Gyu Park ,  Yong Jin Yeon ,  Jea Yeol Choi

    IPC分类号： H01G4/30 ,  H01G4/228 ,  H01G4/12 ,  H01G4/012

    摘要： A multilayer capacitor includes a body including a stacked structure formed of a plurality of dielectric layers, and a plurality of internal electrodes, and external electrodes, wherein the body is divided into a central portion, and cover portions, the body has first to sixth surfaces, in the body, the cover portion forms corner edges having a curved surface, and if a radius of curvature of each of the corner edges at which the third and fourth surfaces meet the fifth and sixth surfaces refers to R1, and a radius of curvature of each of the corner edges at which the third and fourth surfaces meet the first and second surfaces refers to R2, a relationship of R1>R2 is satisfied, and a width of an internal electrode disposed in the cover portion is narrower than a width of an internal electrode disposed in the central portion.

    Multilayer ceramic electronic component
    4.
    发明授权
    Multilayer ceramic electronic component 有权

    公开(公告)号：US11756734B2

    公开(公告)日：2023-09-12

    申请号：US17529870

    申请日：2021-11-18

    申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

    发明人： Yong Jin Yun ,  So Ra Kang ,  Ki Pyo Hong ,  Byeong Gyu Park ,  Jong Ho Lee ,  Jung Min Park

    IPC分类号： H01G4/232 ,  H01G4/224 ,  H01G4/12 ,  H01G4/30

    CPC分类号： H01G4/232 ,  H01G4/1227 ,  H01G4/224 ,  H01G4/30

    摘要： A multilayer ceramic electronic component includes a body including a dielectric layer, first and second internal electrodes, a stacked portion including first and second surfaces opposing each other in a stacking direction of the first and second internal electrodes, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first and second surfaces, connected to the third and fourth surfaces, and opposing each other, and a coating layer disposed on the first to sixth surfaces of the stacked portion and having first and second connection portions; and first and second external electrodes connected to the first and second internal electrodes, respectively, and arranged on the third and fourth surfaces of the body, wherein the first and second internal electrodes are respectively connected to the first and second external electrodes through the first and second connection portions.

    Chip inductor
    6.
    发明授权
    Chip inductor 有权
    芯片电感

    公开(公告)号：US09472608B2

    公开(公告)日：2016-10-18

    申请号：US13907808

    申请日：2013-05-31

    申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

    发明人： Hwan Soo Lee ,  Hye Yeon Cha ,  Jung Min Park ,  Kang Heon Hur ,  Moon Soo Park

    IPC分类号： H01L27/08 ,  H01L49/02

    CPC分类号： H01L28/10 ,  H01F27/24 ,  H01F27/255 ,  H01F27/2804 ,  H01F27/292

    摘要： Disclosed herein is a chip inductor. The chip inductor according to the present invention includes a substrate on which a through-hole is formed, a conductive coil that is formed on the substrate, an upper resin composite magnetic layer that is filled to surround the conductive coil so that a core is formed on a center portion of the substrate, a lower resin composite magnetic layer that is formed on a bottom portion of the substrate, and an external electrode that is formed on both sides of the upper and lower resin composite magnetic layers.

    摘要翻译： 这里公开了一种芯片电感器。 根据本发明的芯片电感器包括形成有通孔的基板，形成在基板上的导电线圈，被填充以包围导电线圈以形成芯的上部树脂复合磁性层 在基板的中心部分上，形成在基板的底部的下部树脂复合磁性层和形成在上部和下部树脂复合磁性层两侧的外部电极。

    Multilayer ceramic electronic component
    7.
    发明授权
    Multilayer ceramic electronic component 有权

    公开(公告)号：US11227720B2

    公开(公告)日：2022-01-18

    申请号：US16864754

    申请日：2020-05-01

    申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

    发明人： Yong Jin Yun ,  So Ra Kang ,  Ki Pyo Hong ,  Byeong Gyu Park ,  Jong Ho Lee ,  Jung Min Park

    IPC分类号： H01G4/232 ,  H01G4/224 ,  H01G4/12 ,  H01G4/30

    摘要： A multilayer ceramic electronic component includes a body including a dielectric layer, first and second internal electrodes, a stacked portion including first and second surfaces opposing each other in a stacking direction of the first and second internal electrodes, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first and second surfaces, connected to the third and fourth surfaces, and opposing each other, and a coating layer disposed on the first to sixth surfaces of the stacked portion and having first and second connection portions; and first and second external electrodes connected to the first and second internal electrodes, respectively, and arranged on the third and fourth surfaces of the body, wherein the first and second internal electrodes are respectively connected to the first and second external electrodes through the first and second connection portions.

    Multilayer capacitor
    8.
    发明授权
    Multilayer capacitor 有权

    公开(公告)号：US10950387B2

    公开(公告)日：2021-03-16

    申请号：US16533064

    申请日：2019-08-06

    申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

    发明人： Yong Jin Yeon ,  Jung Min Park ,  Byeong Gyu Park ,  So Ra Kang ,  Jea Yeol Choi

    IPC分类号： H01G4/30 ,  H01G4/228 ,  H01G4/12 ,  H01G4/012

    摘要： A multilayer capacitor includes a body including a stacked structure having dielectric layers, and internal electrodes, and external electrodes. The body has a central portion, and cover portions disposed above and below the central portion, the body has a first surface and a second surface to which the internal electrodes are exposed and which oppose each other, a third surface and a fourth surface which oppose each other in the stacking direction of the dielectric layers, and a fifth surface and a sixth surface which are connected to the first to fourth surfaces and oppose each other, and a surface roughness of each of the third to sixth surfaces of the body is greater than a surface roughness of each of the first and second surfaces of the body.

    Magnetic module for power inductor, power inductor, and manufacturing method thereof
    9.
    发明授权
    Magnetic module for power inductor, power inductor, and manufacturing method thereof 有权
    用于功率电感器，功率电感器的磁性模块及其制造方法

    公开(公告)号：US09478334B2

    公开(公告)日：2016-10-25

    申请号：US13839607

    申请日：2013-03-15

    申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

    发明人： Sang Soo Park ,  Young Ghyu Ahn ,  Jung Min Park ,  Min Cheol Park

    IPC分类号： H01F5/00 ,  H01F27/28 ,  H01F41/04 ,  H01F17/00 ,  H01F17/04 ,  H01F27/29

    CPC分类号： H01F5/00 ,  H01F17/0013 ,  H01F17/04 ,  H01F27/292 ,  H01F41/04 ,  H01F41/046 ,  Y10T29/4902

    摘要： There is provided a power inductor including: a main body; and first and second external electrodes formed on both end portions of the main body, wherein the main body includes: upper and lower cover layers; at least one coil support layer having a through hole formed in a center thereof, at least one first recess portion formed in both lateral surfaces thereof and a plurality of second recess portions formed in respective corners thereof, and disposed between the upper and lower cover layers; and first and second coil layers formed on both surfaces of the coil support layer and having respective one ends thereof connected to the first and second external electrodes.

    摘要翻译： 提供了一种功率电感器，包括：主体; 以及形成在主体的两端部的第一外部电极和第二外部电极，其中主体包括：上部和下部覆盖层; 至少一个线圈支撑层，其中心形成有通孔，至少一个形成在其两个侧面的第一凹部和形成在其各个角部的多个第二凹部，并设置在上盖层和下盖层之间 ; 以及形成在线圈支撑层的两个表面上的第一和第二线圈层，并且其相应的一端连接到第一和第二外部电极。