Invention Grant
- Patent Title: Power superjunction MOSFET device with resurf regions
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Application No.: US14993671Application Date: 2016-01-12
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Publication No.: US09660070B2Publication Date: 2017-05-23
- Inventor: Tomohiro Tamaki , Yoshito Nakazawa , Satoshi Eguchi
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Tokyo
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Tokyo
- Agency: Shapiro, Gabor and Rosenberger, PLLC
- Priority: JP2009-263600 20091119
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/40 ; H01L29/66 ; H01L29/739 ; H01L27/088 ; H01L29/10 ; H01L29/06 ; H01L29/417

Abstract:
A semiconductor device which solves the following problem of a super junction structure: due to a relatively high concentration in the body cell region (active region), in peripheral areas (peripheral regions or junction end regions), it is difficult to achieve a breakdown voltage equivalent to or higher than in the cell region through a conventional junction edge terminal structure or resurf structure. The semiconductor device includes a power MOSFET having a super junction structure formed in the cell region by a trench fill technique. Also, super junction structures having orientations parallel to the sides of the cell region are provided in a drift region around the cell region.
Public/Granted literature
- US20160126345A1 Semiconductor device and method for manufacturing the same Public/Granted day:2016-05-05
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