发明授权
- 专利标题： Method of manufacturing electronic device, electronic apparatus, and mobile apparatus
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申请号： US14031663申请日： 2013-09-19
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公开(公告)号： US09660176B2公开(公告)日： 2017-05-23
- 发明人: Hideo Miyasaka
- 申请人： Seiko Epson Corporation
- 申请人地址： JP
- 专利权人： Seiko Epson Corporation
- 当前专利权人： Seiko Epson Corporation
- 当前专利权人地址： JP
- 代理机构： Harness, Dickey & Pierce, P.L.C.
- 优先权： JP2012-211896 20120926
- 主分类号： B23K31/02
- IPC分类号： B23K31/02 ; H01L41/23 ; H03H9/10 ; B23K1/00 ; B23K1/005 ; G01C19/5628 ; B23K101/36
摘要：
A method of manufacturing an electronic device including an electronic element, a base substrate, and a lid member, includes joining the lid member to the sealing part by application of an energy beam so that a plate thickness of the lid member may be larger in a part joined to the sealing part than in a part located inside of the part in a plan view along the thickness direction.
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