Invention Grant
- Patent Title: Metal-clad laminate and printed wiring board
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Application No.: US14364914Application Date: 2012-11-29
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Publication No.: US09661749B2Publication Date: 2017-05-23
- Inventor: Hiroharu Inoue , Koji Kishino
- Applicant: Panasonic Corporation
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2011-275787 20111216
- International Application: PCT/JP2012/007664 WO 20121129
- International Announcement: WO2013/088659 WO 20130620
- Main IPC: H05K1/00
- IPC: H05K1/00 ; B32B7/02 ; H05K1/03 ; H05K3/02 ; B32B5/02 ; B32B15/12 ; B32B15/14

Abstract:
A metal-clad laminate according to the present embodiment includes an insulating layer, and a metal layer present on at least one surface side of the insulating layer. The insulating layer is a laminate of at least three layers of a center layer, a first resin layer present on one surface side of the center layer, and a second resin layer present on the other surface side of the center layer. The center layer, the first resin layer and the second resin layer each contain a cured product of a resin composition. Coefficients of thermal expansion of the cured products of the resin compositions contained in the first resin layer and the second resin layer are smaller than a coefficient of thermal expansion of the cured product of the resin composition contained in the center layer.
Public/Granted literature
- US20140374142A1 METAL-PLATED LAMINATED BOARD, AND PRINTED WIRING BOARD Public/Granted day:2014-12-25
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