A bundle spacing device having a first pair of opposing surfaces spaced apart from each other a first distance and a second pair of opposing surfaces spaced apart from each other a second distance, different than the first distance, and generally perpendicular to the first pair of opposing surfaces. The bundle spacing device is configured such that bundles can be coupled to the bundle spacing device in a first position or a second position. The bundle spacing device can also have a first passage extending along a first axis, a second passage extending along a second axis that is perpendicular to the first axis, and a third passage extending along a third axis that is perpendicular to the first axis and parallel to the second axis.