Bundle Spacing Device
    2.
    发明申请
    Bundle Spacing Device 审中-公开
    捆绑间隔装置

    公开(公告)号:US20150291326A1

    公开(公告)日:2015-10-15

    申请号:US14737004

    申请日:2015-06-11

    Applicant: Panduit Corp.

    Abstract: A bundle spacing device having a first pair of opposing surfaces spaced apart from each other a first distance and a second pair of opposing surfaces spaced apart from each other a second distance, different than the first distance, and generally perpendicular to the first pair of opposing surfaces. The bundle spacing device is configured such that bundles can be coupled to the bundle spacing device in a first position or a second position. The bundle spacing device can also have a first passage extending along a first axis, a second passage extending along a second axis that is perpendicular to the first axis, and a third passage extending along a third axis that is perpendicular to the first axis and parallel to the second axis.

    Abstract translation: 一种束间隔装置,具有第一对相对表面彼此间隔开第一距离,第二对相对表面彼此间隔开第二距离,第二距离不同于第一距离,并且大致垂直于第一对相对 表面。 束间隔装置被配置成使得束可以在第一位置或第二位置处联接到束间隔装置。 束间隔装置还可以具有沿着第一轴线延伸的第一通道,沿着垂直于第一轴线的第二轴线延伸的第二通道,以及沿垂直于第一轴线并平行的第三轴线延伸的第三通道 到第二轴。

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