Invention Grant
- Patent Title: Aluminum nitride powder, resin composition, and thermally conductive molded object
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Application No.: US15123299Application Date: 2014-12-16
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Publication No.: US09663635B2Publication Date: 2017-05-30
- Inventor: Yoshiharu Hatakeyama , Kenichi Fujikawa , Miho Yamaguchi , Yuji Yamagishi , Akihiro Oohashi
- Applicant: NITTO DENKO CORPORATION , NITTO SHINKO CORPORATION
- Applicant Address: JP Osaka JP Fukui
- Assignee: NITTO DENKO CORPORATION,NITTO SHINKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION,NITTO SHINKO CORPORATION
- Current Assignee Address: JP Osaka JP Fukui
- Agency: Sughrue Mion, PLLC
- Priority: JP2014-041602 20140304
- International Application: PCT/JP2014/083292 WO 20141216
- International Announcement: WO2015/133037 WO 20150911
- Main IPC: C08K9/00
- IPC: C08K9/00 ; C08K9/04 ; C01B21/072 ; C08K3/28 ; C09K5/14
Abstract:
The present invention provides, as an aluminum nitride powder excellent in the water resistance, an aluminum nitride powder subjected to a surface treatment with a predetermined organic compound. The present invention also provides a resin composition including the aluminum nitride powder and a resin, and a thermal conductive molded article obtained by molding the resin composition.
Public/Granted literature
- US20170066908A1 ALUMINUM NITRIDE POWDER, RESIN COMPOSITION, AND THERMALLY CONDUCTIVE MOLDED OBJECT Public/Granted day:2017-03-09
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