Methods for thermal management of an integrated circuit are disclosed. In particular, a dual control loop, having a first control loop and a second control loop, is used to maintain the temperature of an integrated circuit at a first temperature and a second temperature, respectively. In order to prevent the integrated circuit from overheating during periods of rapid temperature increase, the second control loop may be configured to control temperature at the second temperature below the specification limit of the integrated circuit by reducing power to the integrated circuit. The second control loop samples and maintains temperature of the integrated circuit at time intervals relatively faster than that of the first control loop. However, the second control loop is configured to release control to the first control loop when the temperature of the integrated circuit is reduced. The first control loop may then control power to the integrated circuit.