Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
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Application No.: US14626241Application Date: 2015-02-19
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Publication No.: US09666464B2Publication Date: 2017-05-30
- Inventor: Hiroshi Kikuchi , Naoto Saito
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: JP2014-033015 20140224
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L21/673

Abstract:
Provided is a substrate processing apparatus including: a carry-in area where a placing table is provided to place thereon a carrying container including a take-out opening, a flange formed on an upper portion of a side formed with the take-out opening, and a recess formed on a top surface of the flange; a transfer area maintained under an atmosphere different from that of the carry-in area; a partition wall configured to partition the carry-in area and the transfer area and formed with an opening; a door configured to open/close the opening; a carrying container pressing unit configured to press the carrying container placed on the placing table against the partition wall so that the take-out opening of the carrying container faces the opening of the partition wall; and a carrying container holding unit configured to be inserted into the recess to press the carrying container against the partition wall.
Public/Granted literature
- US20150243540A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Public/Granted day:2015-08-27
Information query
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