公开(公告)号：US20150255319A1

公开(公告)日：2015-09-10

申请号：US14633792

申请日：2015-02-27

Applicant: Tokyo Electron Limited

Inventor： Hiroshi Kikuchi ,  Eiki Fujii

IPC: H01L21/677 ,  H01L21/673

CPC classification number: H01L21/67379 ,  H01L21/6773 ,  H01L21/67769 ,  H01L21/68707

Abstract: Provided is a method of conveying a storage container from a placing table to a conveyance place using a conveying mechanism in a substrate processing apparatus. The storage container hermetically stores a substrate and includes a flange portion formed on the top thereof. The conveying mechanism includes a hand portion provided with a flange insertion portion. The substrate processing apparatus is provided with at least two placing tables arranged side by side in a first horizontal direction. The method includes moving the placing table to the conveyance place in the second horizontal direction by a predetermined distance; sliding the hand portion from a side of a placing table neighboring to the placing table in the first horizontal direction such that the flange portion is inserted into the flange inserting portion; and conveying the storage container from the placing table to the conveyance place through the hand portion.

Abstract translation: 提供了一种在基板处理装置中使用输送机构将储存容器从放置台输送到输送场所的方法。 存储容器气密地存储基板，并且包括形成在其顶部上的凸缘部分。 输送机构包括设置有凸缘插入部的手部。 基板处理装置设置有沿第一水平方向并排布置的至少两个放置台。 该方法包括将放置台沿第二水平方向移动预定距离的输送位置; 在第一水平方向上将手部从放置台的相邻侧面滑动，使得凸缘部插入凸缘插入部; 并通过手部将储存容器从放置台传送到运送场所。

公开(公告)号：US09666464B2

公开(公告)日：2017-05-30

申请号：US14626241

申请日：2015-02-19

Applicant: Tokyo Electron Limited

Inventor： Hiroshi Kikuchi ,  Naoto Saito

IPC: H01L21/677 ,  H01L21/673

CPC classification number: H01L21/67775 ,  H01L21/67379 ,  H01L21/67772

Abstract: Provided is a substrate processing apparatus including: a carry-in area where a placing table is provided to place thereon a carrying container including a take-out opening, a flange formed on an upper portion of a side formed with the take-out opening, and a recess formed on a top surface of the flange; a transfer area maintained under an atmosphere different from that of the carry-in area; a partition wall configured to partition the carry-in area and the transfer area and formed with an opening; a door configured to open/close the opening; a carrying container pressing unit configured to press the carrying container placed on the placing table against the partition wall so that the take-out opening of the carrying container faces the opening of the partition wall; and a carrying container holding unit configured to be inserted into the recess to press the carrying container against the partition wall.

公开(公告)号：US20160273836A1

公开(公告)日：2016-09-22

申请号：US15070123

申请日：2016-03-15

Applicant: Tokyo Electron Limited

Inventor： Mitsuru Obara ,  Hisashi Inoue ,  Keishi Shionaga ,  Masahiro Kobayashi ,  Norio Baba ,  Hiroshi Kikuchi

IPC: F27B5/04 ,  F16B2/02 ,  H01L21/67 ,  H01L21/673 ,  H01L21/677

CPC classification number: F27B5/04 ,  F16B2/02 ,  F27B17/0016 ,  F27B17/0025 ,  F27D3/0084 ,  F27D2003/0012 ,  F27D2003/0046 ,  H01L21/67109 ,  H01L21/67379 ,  H01L21/67389 ,  H01L21/6773 ,  H01L21/67742 ,  H01L21/67772 ,  H01L21/67775

Abstract: The clamp apparatus of the present disclosure includes a clamp member configured to contact a substrate accommodating container from an upper side and fix the substrate accommodating container to a predetermined position when a cover provided on a front surface of the substrate accommodating container is opened/closed, a driving mechanism configured to drive the clamp member; a casing configured to cover the driving mechanism, a suction port configured to communicate with the casing, an exhaust chamber provided near the casing, and a fan provided inside the exhaust chamber.

Abstract translation: 本公开的夹紧装置包括夹持构件，其构造成当设置在基板容纳容器的前表面上的盖被打开/关闭时，从上侧接触基板容纳容器并将基板容纳容器固定到预定位置， 构造成驱动所述夹紧构件的驱动机构; 被构造成覆盖驱动机构的壳体，构造成与壳体连通的吸入口，设置在壳体附近的排气室和设置在排气室内的风扇。

公开(公告)号：US20150211796A1

公开(公告)日：2015-07-30

申请号：US14604866

申请日：2015-01-26

Applicant: Tokyo Electron Limited

Inventor： Hiroshi Kikuchi ,  Yoshiyuki Kobayashi

IPC: F27D1/18

CPC classification number: F27D1/1808 ,  F27B17/0025

Abstract: The present disclosure provides a support mechanism for supporting a cover that performs sealing of a furnace opening of a heat treatment furnace or release the sealing by being moved up or down by an elevating unit. The support mechanism includes a first elastic body having a first elastic modulus; and a second elastic body having a second elastic modulus larger than the first elastic modulus. A reaction force in relation to the first elastic body is applied to the cover when the cover abuts on the furnace opening by being moved up by the elevating unit, and a reaction force in relation to the first elastic body and the second elastic body is applied to the cover after the cover abuts on the furnace opening by being moved up by the elevating unit.

Abstract translation: 本公开提供了一种用于支撑执行热处理炉的炉口的密封的盖的支撑机构，或者通过升降单元向上或向下移动来释放密封。 支撑机构包括具有第一弹性模量的第一弹性体; 以及具有大于第一弹性模量的第二弹性模量的第二弹性体。 当盖子被升降单元向上移动时，当盖子靠近炉子开口时，相对于第一弹性体的反作用力被施加到盖上，并施加相对于第一弹性体和第二弹性体的反作用力 在盖子通过升降单元向上移动之后抵靠在炉子开口上的盖子。

公开(公告)号：US11114318B2

公开(公告)日：2021-09-07

申请号：US16394140

申请日：2019-04-25

Applicant: Tokyo Electron Limited

Inventor： Hisashi Inoue ,  Masahiro Kobayashi ,  Michihiro Takahashi ,  Tamotsu Hatakeyama ,  Harunari Hasegawa ,  Hiroshi Kikuchi ,  Yoshihisa Kumagai

IPC: B23P19/10 ,  H01L21/67 ,  H01L21/673 ,  B23P19/04

Abstract: Provided is an assembling apparatus for a semiconductor manufacturing apparatus. The assembling apparatus includes: a body; lift attached to the body and configured to move a reaction tube having an opening at a lower end portion thereof vertically, thereby allowing a gas supply pipe to be installed inside the reaction tube through the opening while the reaction tube is held by the lift; gas supply source configured to supply a gas into the reaction tube through the gas supply pipe while the reaction tube is held by the lift; and an exhaust mechanism including a pump configured to exhaust an inside of the reaction tube through the opening, thereby performing a leakage test of the reaction tube while the reaction tube is held by the lift.

公开(公告)号：US20190333789A1

公开(公告)日：2019-10-31

申请号：US16394140

申请日：2019-04-25

Applicant: Tokyo Electron Limited

Inventor： Hisashi Inoue ,  Masahiro Kobayashi ,  Michihiro Takahashi ,  Tamotsu Hatakeyama ,  Harunari Hasegawa ,  Hiroshi Kikuchi ,  Yoshihisa Kumagai

IPC: H01L21/67 ,  H01L21/673

Abstract: Provided is an assembling apparatus for a semiconductor manufacturing apparatus. The assembling apparatus includes: a body; lift attached to the body and configured to move a reaction tube having an opening at a lower end portion thereof vertically, thereby allowing a gas supply pipe to be installed inside the reaction tube through the opening while the reaction tube is held by the lift; gas supply source configured to supply a gas into the reaction tube through the gas supply pipe while the reaction tube is held by the lift; and an exhaust mechanism including a pump configured to exhaust an inside of the reaction tube through the opening, thereby performing a leakage test of the reaction tube while the reaction tube is held by the lift.

公开(公告)号：US09803926B2

公开(公告)日：2017-10-31

申请号：US14604866

申请日：2015-01-26

Applicant: Tokyo Electron Limited

Inventor： Hiroshi Kikuchi ,  Yoshiyuki Kobayashi

IPC: F27D1/18 ,  F27B17/00

CPC classification number: F27D1/1808 ,  F27B17/0025

Abstract: The present disclosure provides a support mechanism for supporting a cover that performs sealing of a furnace opening of a heat treatment furnace or release the sealing by being moved up or down by an elevating unit. The support mechanism includes a first elastic body having a first elastic modulus; and a second elastic body having a second elastic modulus larger than the first elastic modulus. A reaction force in relation to the first elastic body is applied to the cover when the cover abuts on the furnace opening by being moved up by the elevating unit, and a reaction force in relation to the first elastic body and the second elastic body is applied to the cover after the cover abuts on the furnace opening by being moved up by the elevating unit.

公开(公告)号：US20150243540A1

公开(公告)日：2015-08-27

申请号：US14626241

申请日：2015-02-19

Applicant: TOKYO ELECTRON LIMITED

Inventor： Hiroshi Kikuchi ,  Naoto Saito

IPC: H01L21/677

CPC classification number: H01L21/67775 ,  H01L21/67379 ,  H01L21/67772

Abstract: Provided is a substrate processing apparatus including: a carry-in area where a placing table is provided to place thereon a carrying container including a take-out opening, a flange formed on an upper portion of a side formed with the take-out opening, and a recess formed on a top surface of the flange; a transfer area maintained under an atmosphere different from that of the carry-in area; a partition wall configured to partition the carry-in area and the transfer area and formed with an opening; a door configured to open/close the opening; a carrying container pressing unit configured to press the carrying container placed on the placing table against the partition wall so that the take-out opening of the carrying container faces the opening of the partition wall; and a carrying container holding unit configured to be inserted into the recess to press the carrying container against the partition wall.

Abstract translation: 本发明提供一种基板处理装置，其特征在于，包括：搬运台，其设置有放置台架的搬运台，所述搬运台具有包括取出开口的承载容器，形成在所述取出开口的一侧的上部的凸缘， 以及形成在所述凸缘的顶表面上的凹部; 在与携带区域不同的气氛下保持的转移区域; 分隔壁，其被构造成分隔所述进入区域和所述传送区域并形成有开口; 构造成打开/关闭开口的门; 承载容器按压单元，其构造为将放置在放置台上的承载容器压靠在隔壁上，使得承载容器的取出开口朝向分隔壁的开口; 以及携带容器保持单元，其构造成插入到所述凹部中，以将所述承载容器压靠在所述分隔壁上。

公开(公告)号：US09899245B2

公开(公告)日：2018-02-20

申请号：US14633792

申请日：2015-02-27

Applicant: Tokyo Electron Limited

Inventor： Hiroshi Kikuchi ,  Eiki Fujii

IPC: H01L21/677 ,  H01L21/673 ,  H01L21/687

CPC classification number: H01L21/67379 ,  H01L21/6773 ,  H01L21/67769 ,  H01L21/68707

Abstract: Provided is a method of conveying a storage container from a placing table to a conveyance place using a conveying mechanism in a substrate processing apparatus. The storage container hermetically stores a substrate and includes a flange portion formed on the top thereof. The conveying mechanism includes a hand portion provided with a flange insertion portion. The substrate processing apparatus is provided with at least two placing tables arranged side by side in a first horizontal direction. The method includes moving the placing table to the conveyance place in the second horizontal direction by a predetermined distance; sliding the hand portion from a side of a placing table neighboring to the placing table in the first horizontal direction such that the flange portion is inserted into the flange inserting portion; and conveying the storage container from the placing table to the conveyance place through the hand portion.

公开(公告)号：US09857124B2

公开(公告)日：2018-01-02

申请号：US15070123

申请日：2016-03-15

Applicant: Tokyo Electron Limited

Inventor： Mitsuru Obara ,  Hisashi Inoue ,  Keishi Shionaga ,  Masahiro Kobayashi ,  Norio Baba ,  Hiroshi Kikuchi

IPC: F26B5/04 ,  F27B5/04 ,  H01L21/673 ,  H01L21/677 ,  H01L21/67 ,  F16B2/02 ,  F27B17/00 ,  F27D3/00

CPC classification number: F27B5/04 ,  F16B2/02 ,  F27B17/0016 ,  F27B17/0025 ,  F27D3/0084 ,  F27D2003/0012 ,  F27D2003/0046 ,  H01L21/67109 ,  H01L21/67379 ,  H01L21/67389 ,  H01L21/6773 ,  H01L21/67742 ,  H01L21/67772 ,  H01L21/67775

Abstract: The clamp apparatus of the present disclosure includes a clamp member configured to contact a substrate accommodating container from an upper side and fix the substrate accommodating container to a predetermined position when a cover provided on a front surface of the substrate accommodating container is opened/closed, a driving mechanism configured to drive the clamp member; a casing configured to cover the driving mechanism, a suction port configured to communicate with the casing, an exhaust chamber provided near the casing, and a fan provided inside the exhaust chamber.