The present disclosure relates to a ring-frame power package. The ring-frame power package includes a thermal carrier and a ring structure. The thermal carrier has a carrier surface. The ring structure is disposed over the carrier surface of the thermal carrier so that a portion of the carrier surface is exposed through an interior opening of the ring body. The ring structure also includes one or more interconnect tabs that extend outward from an outer periphery of the ring body. Each interconnect tab includes a top plated area that covers at least a portion of a top surface and a bottom plated area that covers at least a bottom surface of the respective interconnect tab. Notably, each top plated area also covers a contact portion of the ring body that is adjacent to the respective interconnect tab. Each top plated area is electrically coupled to the corresponding bottom plated area.