Invention Grant
- Patent Title: Multi-terminal electronic component, method of manufacturing the same, and board having the same
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Application No.: US14672040Application Date: 2015-03-27
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Publication No.: US09668348B2Publication Date: 2017-05-30
- Inventor: Jae Hoon Lee , Jung Min Nam , Young Key Kim , Hae In Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2014-0134544 20141006
- Main IPC: H01C1/012
- IPC: H01C1/012 ; H05K1/18 ; H01C1/142 ; H05K1/11
Abstract:
A multi-terminal electronic component includes: a base material; a resistance layer disposed on a surface of the base material; a first terminal and a second terminal disposed to be spaced apart from each other while covering portions of the resistance layer, respectively; and a third terminal disposed between the first terminal and the second terminal and covering a portion of the resistance layer, wherein first and second side surfaces of the base material opposing each other are exposed from the first through third terminals.
Public/Granted literature
- US20160099093A1 MULTI-TERMINAL ELECTRONIC COMPONENT, METHOD OF MANUFACTURING THE SAME, AND BOARD HAVING THE SAME Public/Granted day:2016-04-07
Information query
