Array type chip resistor and method of manufacturing thereof
    1.
    发明授权
    Array type chip resistor and method of manufacturing thereof 有权
    阵列型片式电阻器及其制造方法

    公开(公告)号:US08987864B2

    公开(公告)日:2015-03-24

    申请号:US14018801

    申请日:2013-09-05

    Abstract: There is provided an array type chip resistor including: a chip body, four pairs of lower electrodes disposed on both sides of a lower surface of the chip body and formed so as to be extended to edges of the chip body, side electrodes formed so that the lower electrodes are extended to sides of the chip body, and a resistor interposed between the lower electrodes on the lower surface of the chip body and electrically connected to the lower electrode through a contact portion, wherein when a width of the side electrode is defined as d1, a distance between adjacent side electrodes is defined as d2, and a height of the side electrode is defined as h, in the case in which d1/d2 is 0.5 to 1.5, a value of h is 4,300/d1 μm or above and is 0.24d2+87.26 μm or less.

    Abstract translation: 提供了一种阵列式芯片电阻器,包括:芯片体,设置在芯片体的下表面的两侧的四对下电极,并且形成为延伸到芯片主体的边缘,形成为使得 下部电极延伸到芯片主体的侧面,并且电阻器插入在芯片主体的下表面上的下部电极之间,并通过接触部分电连接到下部电极,其中当限定侧面电极的宽度时 作为d1,将相邻的侧面电极之间的距离定义为d2,将侧面电极的高度定义为h,在d1 / d2为0.5〜1.5的情况下,h的值为4300 /d1μm以上 为0.24d2 +87.26μm以下。

    VARISTOR
    2.
    发明申请
    VARISTOR 审中-公开

    公开(公告)号:US20200168373A1

    公开(公告)日:2020-05-28

    申请号:US16572123

    申请日:2019-09-16

    Abstract: A varistor includes a substrate, a varistor body disposed on one surface of the substrate, first and second electrodes disposed on the varistor body and spaced apart from each other, an insulating layer disposed on at least two of the first and second electrodes and the varistor body, and first and second terminals disposed on first and second sides of the substrate opposing each other, electrically connected to the first and second electrodes, respectively, and spaced apart from each other. The substrate has mechanical strength greater than that of the varistor body.

    Resistor element and resistor element assembly

    公开(公告)号:US09953749B2

    公开(公告)日:2018-04-24

    申请号:US15464649

    申请日:2017-03-21

    CPC classification number: H01C1/06 H01C1/012 H01C1/14

    Abstract: A resistor element includes a base substrate having first and second surfaces opposing each other; a resistor layer disposed on the first surface of the base substrate; first and second terminals disposed on opposing end portions of the base substrate, respectively, and electrically connected to opposing sides of the resistor layer, respectively; a third terminal disposed between the first terminal and the second terminal on the second surface of the base substrate and spaced apart from the first terminal and the second terminal; and electrostatic discharge (ESD)-preventing members connecting the first terminal and the third terminal to each other and connecting the second terminal and the third terminal to each other.

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