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1.
公开(公告)号:US08987864B2
公开(公告)日:2015-03-24
申请号:US14018801
申请日:2013-09-05
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor: Jung Il Kim , Ha Sung Hwang , Hae In Kim , Ichiro Tanaka , Oh Sung Kwon
CPC classification number: H01L28/20 , H01C1/01 , H01C1/14 , H01C1/142 , H01C7/003 , H01C17/281 , H01L28/24
Abstract: There is provided an array type chip resistor including: a chip body, four pairs of lower electrodes disposed on both sides of a lower surface of the chip body and formed so as to be extended to edges of the chip body, side electrodes formed so that the lower electrodes are extended to sides of the chip body, and a resistor interposed between the lower electrodes on the lower surface of the chip body and electrically connected to the lower electrode through a contact portion, wherein when a width of the side electrode is defined as d1, a distance between adjacent side electrodes is defined as d2, and a height of the side electrode is defined as h, in the case in which d1/d2 is 0.5 to 1.5, a value of h is 4,300/d1 μm or above and is 0.24d2+87.26 μm or less.
Abstract translation: 提供了一种阵列式芯片电阻器,包括:芯片体,设置在芯片体的下表面的两侧的四对下电极,并且形成为延伸到芯片主体的边缘,形成为使得 下部电极延伸到芯片主体的侧面,并且电阻器插入在芯片主体的下表面上的下部电极之间,并通过接触部分电连接到下部电极,其中当限定侧面电极的宽度时 作为d1,将相邻的侧面电极之间的距离定义为d2,将侧面电极的高度定义为h,在d1 / d2为0.5〜1.5的情况下,h的值为4300 /d1μm以上 为0.24d2 +87.26μm以下。
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公开(公告)号:US20200168373A1
公开(公告)日:2020-05-28
申请号:US16572123
申请日:2019-09-16
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Ic Seob KIM , Jung Il Kim , Hae In Kim , Yong Sung Kim
IPC: H01C7/12 , H01C1/142 , H01C17/065 , H01C17/28
Abstract: A varistor includes a substrate, a varistor body disposed on one surface of the substrate, first and second electrodes disposed on the varistor body and spaced apart from each other, an insulating layer disposed on at least two of the first and second electrodes and the varistor body, and first and second terminals disposed on first and second sides of the substrate opposing each other, electrically connected to the first and second electrodes, respectively, and spaced apart from each other. The substrate has mechanical strength greater than that of the varistor body.
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公开(公告)号:US10204721B2
公开(公告)日:2019-02-12
申请号:US14938716
申请日:2015-11-11
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Young Key Kim , Jea Hoon Lee , Jung Min Nam , Hae In Kim
Abstract: A resistor element includes a base substrate, a resistor layer disposed on one surface of the base substrate, a first electrode layer and a second electrode layer disposed on the resistor layer to be spaced apart from each other, a third electrode layer disposed between the first electrode layer and the second electrode layer to be spaced apart from the first electrode layer and the second electrode layer, a conductive resin electrode disposed on at least one end of the third electrode layer, and first to third plating layers disposed on the first to third electrode layers, respectively.
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公开(公告)号:US10903005B2
公开(公告)日:2021-01-26
申请号:US16168038
申请日:2018-10-23
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Hae In Kim , Eun Ju Oh , Yong Sung Kim
IPC: H01G4/40 , H01G4/38 , H01G4/12 , H01G2/06 , H01G2/22 , H05K1/18 , H01G4/30 , H01G4/012 , H05K1/02
Abstract: A composite electronic component includes a capacitor including a capacitor body including a dielectric layer and first and second internal electrodes alternately stacked with the dielectric layer interposed therebetween, and first and second electrodes disposed on the capacitor body, and a varistor including a varistor body including ZnO and third and fourth electrodes disposed on the varistor body, wherein the first electrode is electrically connected to the third electrode and the second electrode is electrically connected to the fourth electrode.
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公开(公告)号:US10706994B2
公开(公告)日:2020-07-07
申请号:US16535434
申请日:2019-08-08
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Ic Seob Kim , Jung Il Kim , Yong Sung Kim , Eun Ju Oh , Su Rim Bae , Hae In Kim
Abstract: A varistor includes a varistor body, a first terminal disposed on one side of the varistor body, a second terminal disposed on the other side of the varistor body, a first electrode disposed on an upper portion of the varistor body, electrically connected to the first terminal, and extending towards the other side of the varistor body, and a second electrode disposed on a lower portion of the varistor body, electrically connected to the second terminal, and extending towards the one side of the varistor body.
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公开(公告)号:US10157699B2
公开(公告)日:2018-12-18
申请号:US14938716
申请日:2015-11-11
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Young Key Kim , Jea Hoon Lee , Jung Min Nam , Hae In Kim
Abstract: A resistor element includes a base substrate, a resistor layer disposed on one surface of the base substrate, a first electrode layer and a second electrode layer disposed on the resistor layer to be spaced apart from each other, a third electrode layer disposed between the first electrode layer and the second electrode layer to be spaced apart from the first electrode layer and the second electrode layer, a conductive resin electrode disposed on at least one end of the third electrode layer, and first to third plating layers disposed on the first to third electrode layers, respectively.
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公开(公告)号:US09754705B2
公开(公告)日:2017-09-05
申请号:US14931684
申请日:2015-11-03
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Hae In Kim , Jung Min Nam , Jea Hoon Lee , Young Key Kim
CPC classification number: H01C1/14 , H01C1/01 , H01C7/003 , H01C17/281 , H05K1/181 , H05K3/3431 , H05K2201/10022 , H05K2201/10045 , Y02P70/611
Abstract: A resistor includes: a base substrate; a resistance layer disposed on one surface of the base substrate; first and second electrode layers disposed to be spaced apart from each other and covering portions of the resistance layer; and a third electrode layer disposed between the first and second electrode layers to be spaced apart from the first and second electrode layers and covering a portion of the resistance layer.
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8.
公开(公告)号:US09668348B2
公开(公告)日:2017-05-30
申请号:US14672040
申请日:2015-03-27
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Jae Hoon Lee , Jung Min Nam , Young Key Kim , Hae In Kim
CPC classification number: H05K1/181 , H01C1/012 , H01C1/142 , H05K1/111 , H05K2201/10022 , H05K2201/10636 , Y02P70/611
Abstract: A multi-terminal electronic component includes: a base material; a resistance layer disposed on a surface of the base material; a first terminal and a second terminal disposed to be spaced apart from each other while covering portions of the resistance layer, respectively; and a third terminal disposed between the first terminal and the second terminal and covering a portion of the resistance layer, wherein first and second side surfaces of the base material opposing each other are exposed from the first through third terminals.
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公开(公告)号:US11264166B2
公开(公告)日:2022-03-01
申请号:US16593692
申请日:2019-10-04
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Su Rim Bae , Jong Pil Lee , Hae In Kim , Eun Ju Oh
Abstract: An interposer includes an interposer body; first and second lower patterns spaced apart from each other on a lower surface of the interposer body; and first and second upper patterns spaced apart from each other on an upper surface of the interposer body. The first and second upper patterns include first and second shape-securing layers spaced apart from each other on the upper surface of the interposer body, and first and second acoustic noise reduction layers disposed on the first and second shape-securing layers, respectively. An electronic component includes a capacitor and the interposer.
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公开(公告)号:US09953749B2
公开(公告)日:2018-04-24
申请号:US15464649
申请日:2017-03-21
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Kwang Hyun Park , Hae In Kim
Abstract: A resistor element includes a base substrate having first and second surfaces opposing each other; a resistor layer disposed on the first surface of the base substrate; first and second terminals disposed on opposing end portions of the base substrate, respectively, and electrically connected to opposing sides of the resistor layer, respectively; a third terminal disposed between the first terminal and the second terminal on the second surface of the base substrate and spaced apart from the first terminal and the second terminal; and electrostatic discharge (ESD)-preventing members connecting the first terminal and the third terminal to each other and connecting the second terminal and the third terminal to each other.
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