Invention Grant
- Patent Title: CMP pads having material composition that facilitates controlled conditioning
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Application No.: US14454785Application Date: 2014-08-08
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Publication No.: US09669512B2Publication Date: 2017-06-06
- Inventor: Rajeev Bajaj , Craig E. Bohn , Fred Conrad Redeker
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: B24B37/24
- IPC: B24B37/24 ; B24B53/017

Abstract:
Embodiments of the disclosure generally provides a method and apparatus for a polishing article or polishing pad having a microstructure that facilitates uniform conditioning when exposed to laser energy. In one embodiment, a polishing pad comprising a combination of a first material and a second material is provided, and the first material is more reactive to laser energy than the second material. In another embodiment, a method of texturing a composite polishing pad is provided. The method includes directing a laser energy source onto a surface of the polishing pad to affect a greater ablation rate within a first material having a greater laser absorption rate and a lesser ablation rate within a second material having a lesser laser absorption rate to provide a micro-textured surface consistent with microstructure of the composite polishing pad.
Public/Granted literature
- US20150044951A1 CMP PADS HAVING MATERIAL COMPOSITION THAT FACILITATES CONTROLLED CONDITIONING Public/Granted day:2015-02-12
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