公开(公告)号：US09669512B2

公开(公告)日：2017-06-06

申请号：US14454785

申请日：2014-08-08

Applicant: Applied Materials, Inc.

Inventor： Rajeev Bajaj ,  Craig E. Bohn ,  Fred Conrad Redeker

IPC: B24B37/24 ,  B24B53/017

CPC classification number: B24B37/245

Abstract: Embodiments of the disclosure generally provides a method and apparatus for a polishing article or polishing pad having a microstructure that facilitates uniform conditioning when exposed to laser energy. In one embodiment, a polishing pad comprising a combination of a first material and a second material is provided, and the first material is more reactive to laser energy than the second material. In another embodiment, a method of texturing a composite polishing pad is provided. The method includes directing a laser energy source onto a surface of the polishing pad to affect a greater ablation rate within a first material having a greater laser absorption rate and a lesser ablation rate within a second material having a lesser laser absorption rate to provide a micro-textured surface consistent with microstructure of the composite polishing pad.