- 专利标题： Underfill composition for encapsulating a bond line
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申请号： US14196581申请日： 2014-03-04
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公开(公告)号： US09670377B2公开(公告)日： 2017-06-06
- 发明人: Pawel Czubarow , Toshiyuki Sato , Tsutomu Masuko
- 申请人： NAMICS CORPORATION
- 申请人地址： JP Niigata
- 专利权人： NAMICS CORPORATION
- 当前专利权人： NAMICS CORPORATION
- 当前专利权人地址： JP Niigata
- 代理机构： Hamre, Schumann, Mueller & Larson, P.C.
- 主分类号： C08K3/04
- IPC分类号： C08K3/04 ; C08K3/28 ; C08L63/00 ; C09D163/00 ; H01L21/56 ; H01L23/00 ; H01L23/29 ; C08K3/22 ; C08K3/38 ; H01L25/065 ; C08K3/34 ; C08G59/50
摘要：
An underfill composition for encapsulating a bond line and a method of using the underfill composition are described. Advantageously, the disclosed underfill composition in an uncured state has a fluidity value of less than about ten minutes over about a two centimeter distance at a temperature of about 90 degrees C. and at a bond line thickness of about 50 microns or less and still have a bulk thermal conductivity that is greater than about 0.8 W/mK in the cured state.
公开/授权文献
- US20150252217A1 UNDERFILL COMPOSITION FOR ENCAPSULATING A BOND LINE 公开/授权日：2015-09-10
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