Invention Grant
- Patent Title: Electronic device having a cover in which a penetration hole is provided and manufacturing method of electronic device
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Application No.: US14477104Application Date: 2014-09-04
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Publication No.: US09671423B2Publication Date: 2017-06-06
- Inventor: Shigekazu Takagi
- Applicant: Seiko Epson Corporation
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2013-183797 20130905
- Main IPC: G01P15/125
- IPC: G01P15/125 ; G01P15/08

Abstract:
An electronic device includes a substrate, a lid which is bonded to the substrate, and a functional element which is provided between the substrate and the lid, in which the lid includes a penetration hole which penetrates a portion between an inner surface and an outer surface, the penetration hole includes a first hole portion and a second hole portion, a flat area of the second hole portion is set to be smaller than a flat area of the first hole portion, at least a part of an inner wall surface of the second hole portion substantially forms a right angle with respect to a bottom surface of the first hole portion, and the penetration hole is sealed with a sealing member.
Public/Granted literature
- US20150059475A1 ELECTRONIC DEVICE, MANUFACTURING METHOD OF ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOVING OBJECT Public/Granted day:2015-03-05
Information query
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