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1.发明授权公开(公告)号：US09420691B2
公开(公告)日：2016-08-16
申请号：US13760702
申请日：2013-02-06
发明人： Shigekazu Takagi
CPC分类号： H05K1/162 , B81B3/0086 , B81B7/007 , B81B2207/095 , B81B2207/096 , B81B2207/097
摘要： An electronic device includes a first member including a reference potential terminal; a second member placed on a first surface of the first member and having conductivity; and a functional element accommodated in a cavity surrounded by the first member and the second member, wherein the second member and the reference potential terminal are electrically connected via a contact portion.
摘要翻译： 电子设备包括：包括参考电位端子的第一构件; 放置在第一构件的第一表面上并具有导电性的第二构件; 以及容纳在由所述第一构件和所述第二构件包围的空腔中的功能元件，其中所述第二构件和所述参考电位端子经由接触部分电连接。
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2.发明授权公开(公告)号：US09796579B2
公开(公告)日：2017-10-24
申请号：US15251423
申请日：2016-08-30
发明人： Shigekazu Takagi
CPC分类号： B81B7/0051 , B81C1/00325 , B81C1/00801 , B81C2201/013 , B81C2201/019 , B81C2201/053 , B81C2203/0109 , B81C2203/0145 , B81C2203/031
摘要： A manufacturing method of an electronic device includes a process that forms a protective layer on at least a portion of the first base body to which a third base body is to be bonded, a process that performs first bonding of a second base body to the first base body, a process that performs a first etching of the second base body bonded by the first bonding, a process that removes the protective layer using a second etching, and a process that performs second bonding of the third base body to the first base body. In the first etching, an etching rate of the second base body is faster than those of the first base body and the protective layer, and in the second etching, an etching rate of the protective layer is faster than those of the first base body and the second base body.
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公开(公告)号：US09678100B2
公开(公告)日：2017-06-13
申请号：US14740911
申请日：2015-06-16
IPC分类号： G01P15/125 , G01P15/08 , G01P3/44
CPC分类号： G01P15/125 , G01P3/44 , G01P15/0802 , G01P2015/0814 , Y10T29/49002
摘要： A functional device according to an embodiment of the invention includes: an insulating substrate; a movable section; movable electrode fingers provided in the movable section; and fixed electrode fingers provided on the insulating substrate and arranged to be opposed to the movable electrode fingers. The fixed electrode fingers include: first fixed electrode fingers arranged on one side of the movable electrode fingers; and second fixed electrode fingers arranged on the other side of the movable electrode fingers. The first fixed electrode fingers and the second fixed electrode fingers are arranged to be spaced apart from each other.
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公开(公告)号：US09671423B2
公开(公告)日：2017-06-06
申请号：US14477104
申请日：2014-09-04
发明人： Shigekazu Takagi
IPC分类号： G01P15/125 , G01P15/08
CPC分类号： G01P15/125 , G01P2015/088 , Y10T29/49117
摘要： An electronic device includes a substrate, a lid which is bonded to the substrate, and a functional element which is provided between the substrate and the lid, in which the lid includes a penetration hole which penetrates a portion between an inner surface and an outer surface, the penetration hole includes a first hole portion and a second hole portion, a flat area of the second hole portion is set to be smaller than a flat area of the first hole portion, at least a part of an inner wall surface of the second hole portion substantially forms a right angle with respect to a bottom surface of the first hole portion, and the penetration hole is sealed with a sealing member.
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公开(公告)号：US09476905B2
公开(公告)日：2016-10-25
申请号：US14267331
申请日：2014-05-01
发明人： Shigekazu Takagi
IPC分类号： G01P15/125 , B81B3/00 , G01P15/08
CPC分类号： G01P15/125 , B81B3/0008 , B81B2201/0235 , G01P2015/0831 , G01P2015/0871
摘要： A sensor element includes: a detection electrode section; a movable body that is provided to face the detection electrode section; and a protruding section that is provided in a region where the detection electrode section is provided in a plan view of the detection electrode section seen in a vertical direction and protrudes toward the movable body. At least a part of a surface of the protruding section is made of an insulating material.
摘要翻译： 传感器元件包括：检测电极部分; 设置成面向所述检测电极部的移动体; 以及设置在检测电极部设置在垂直方向上的检测电极部分的平面图中的区域中的突出部分，并朝向可移动体突出。 突出部的表面的至少一部分由绝缘材料制成。
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6.发明授权公开(公告)号：US09144159B2
公开(公告)日：2015-09-22
申请号：US13760626
申请日：2013-02-06
发明人： Shigekazu Takagi
CPC分类号： H05K5/02 , B81B7/007 , B81B2207/097 , B81C2203/0145 , H05K1/181 , H05K13/00 , H05K2201/09072 , H05K2201/2045 , Y02P70/611 , Y10T29/49155
摘要： An electronic device includes: a first member having a first surface; a second member placed on the side of the first surface; a functional element accommodated in a cavity formed by the first member and the second member; an external connection terminal disposed outside of the cavity on the side of the first surface of the first member; a groove portion disposed on the side of the first surface of the first member and extending from the inside to the outside of the cavity; a wiring disposed within the groove portion and electrically connecting the functional element with the external connection terminal; a first through-hole disposed at a position of the second member, the position overlapping the groove portion in plan view; and a filling member disposed within the first through-hole and filling the groove portion.
摘要翻译： 电子设备包括：具有第一表面的第一构件; 放置在第一表面侧的第二构件; 容纳在由所述第一构件和所述第二构件形成的空腔中的功能元件; 外部连接端子，设置在所述第一部件的所述第一表面侧的所述空腔的外侧; 槽部，其设置在所述第一部件的所述第一面的一侧并从所述腔的内部延伸到所述外部; 布置在所述槽部内并将所述功能元件与所述外部连接端子电连接的布线; 第一通孔，设置在所述第二构件的位置，所述位置在所述凹槽部分的平面图中重叠; 以及填充构件，其设置在所述第一通孔内并填充所述槽部。
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公开(公告)号：US10761109B2
公开(公告)日：2020-09-01
申请号：US16143566
申请日：2018-09-27
发明人： Shogo Inaba , Atsuki Naruse , Shigekazu Takagi , Tomokazu Umeno , Satoru Tanaka
IPC分类号： G01C19/5628 , G01P15/125 , G01P15/08 , G01P15/13 , G01C19/56
摘要： A physical quantity sensor includes a substrate, an element portion disposed so as to overlap the substrate, a conductor pattern disposed on the substrate so as to face the element portion, and a protection film covering at least a part of an exposed portion of the conductor pattern exposed from element portion in a plan view from a direction in which the substrate and the element portion overlap.
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公开(公告)号：US09880000B2
公开(公告)日：2018-01-30
申请号：US14938268
申请日：2015-11-11
发明人： Teruo Takizawa , Atsuki Naruse , Shigekazu Takagi
IPC分类号： G01P15/00 , G01C19/5769 , G01C19/5712 , G01P15/125 , G01P15/08 , B81C1/00
CPC分类号： G01C19/5769 , B81B2201/025 , B81C1/00293 , B81C1/00301 , B81C2203/0145 , G01C19/5712 , G01P15/0802 , G01P15/125 , G01P2015/0814
摘要： A manufacturing method of an inertial sensor which includes a movable body that is disposed in a cavity formed by a base body and a lid, and in which a wiring groove of wiring communicating with the cavity and electrically connected to the movable body is formed in the base body, includes forming a first opening section, which does not penetrate through the lid by wet etching; accommodating the movable body in the cavity by bonding the base body and the lid; forming a first sealing material with which the wiring groove is sealed after the accommodating of the movable body; forming a through-hole communicating with the cavity by penetrating through the first opening section by dry etching after the forming of the first sealing material; and forming a second sealing material with which the through-hole is sealed.
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