- 专利标题: Ultrasonic micron precision molding apparatus
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申请号: US14736680申请日: 2015-06-11
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公开(公告)号: US09671774B2公开(公告)日: 2017-06-06
- 发明人: Chen-Chia Chou , I-Wei Su , Hao-Yen Liao , Kuei-Chih Feng
- 申请人: Chen-Chia Chou
- 申请人地址: TW Taipei
- 专利权人: Chen-Chia Chou
- 当前专利权人: Chen-Chia Chou
- 当前专利权人地址: TW Taipei
- 代理机构: Bacon & Thomas, PLLC
- 优先权: TW103128738A 20140821
- 主分类号: G06F19/00
- IPC分类号: G06F19/00 ; B06B1/02 ; B29C65/00 ; B29C65/08 ; B32B37/00 ; B23B21/00 ; G05B19/18 ; B23D7/06 ; B28D5/04 ; B23D5/00 ; B06B3/00
摘要:
An ultrasonic micron precision molding apparatus includes: an ultrasonic generating module, a tool and an amplitude transformer. The ultrasonic generating module provides ultrasonic frequency vibration. The tool is disposed below the ultrasonic generating module, and has a micron-level precision structure. The amplitude transformer is disposed between the ultrasonic generating module and the tool and has a first section and a second section, the first section is disposed at the junction of the amplitude transformer and the tool, and the distance between the second section and the tool is longer than the distance between the first section and the tool, wherein the width of the first section is greater than the width of the second section.
公开/授权文献
- US20160052066A1 ULTRASONIC MICRON PRECISION MOLDING APPARATUS 公开/授权日:2016-02-25
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