Invention Grant
- Patent Title: Silicone-based thermal interface materials
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Application No.: US14856134Application Date: 2015-09-16
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Publication No.: US09673127B2Publication Date: 2017-06-06
- Inventor: Sarah K. Czaplewski , Joseph Kuczynski , Jason T. Wertz , Jing Zhang
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/373 ; H01L23/44 ; C08G77/38
Abstract:
Embodiments described herein relate to silicone-based thermal interface materials which include a thermally conductive material and a silicone-based polymeric material having a solubility parameter that is not less than 9.09 cal1/2 cm−3/2.
Public/Granted literature
- US20170077008A1 SILICONE-BASED THERMAL INTERFACE MATERIALS Public/Granted day:2017-03-16
Information query
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