Invention Grant
- Patent Title: Semiconductor device structure and method for forming the same
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Application No.: US14584735Application Date: 2014-12-29
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Publication No.: US09673204B2Publication Date: 2017-06-06
- Inventor: Chang-Ming Wu , Tsung-Hsueh Yang , Chung-Chiang Min , Shih-Chang Liu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L27/115
- IPC: H01L27/115 ; H01L27/11521 ; H01L29/06 ; H01L21/762 ; H01L29/66 ; H01L21/28 ; H01L29/423 ; H01L27/11519 ; H01L29/788

Abstract:
A semiconductor device structure is provided. The semiconductor device structure includes a substrate. The semiconductor device structure also includes a first isolation structure partially embedded in the substrate. The first isolation structure has a first upper surface with a first recess. The semiconductor device structure further includes a second isolation structure partially embedded in the substrate. In addition, the semiconductor device structure includes a first gate over the substrate and between the first isolation structure and the second isolation structure. The first gate extends onto the first upper surface to cover the first recess. The semiconductor device structure includes a second gate over the first gate.
Public/Granted literature
- US20160190268A1 SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME Public/Granted day:2016-06-30
Information query
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