Invention Grant
- Patent Title: Actuation mechanisms for electrical interconnections
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Application No.: US13707032Application Date: 2012-12-06
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Publication No.: US09674943B2Publication Date: 2017-06-06
- Inventor: Youngseok Oh , Joe Walczyk
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11 ; H05K3/40

Abstract:
Some embodiments described herein include apparatuses and methods of forming such apparatuses. In one such embodiment, an apparatus may include an electronic arrangement, a first die, and a second die coupled to the first die and the electronic arrangement. The electronic arrangement may include an opening. At least a portion of the die may occupy at least a portion of the opening in the electronic arrangement. Other embodiments including additional apparatuses and methods are described.
Public/Granted literature
- US20140158416A1 ACTUATION MECHANISMS FOR ELECTRICAL INTERCONNECTIONS Public/Granted day:2014-06-12
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