- Patent Title: Self-aligned bottom up gate contact and top down source-drain contact structure in the premetallization dielectric or interlevel dielectric layer of an integrated circuit
-
Application No.: US14734013Application Date: 2015-06-09
-
Publication No.: US09679847B2Publication Date: 2017-06-13
- Inventor: John Hongguang Zhang
- Applicant: STMicroelectronics, Inc.
- Applicant Address: US TX Coppell
- Assignee: STMicroelectronics, Inc.
- Current Assignee: STMicroelectronics, Inc.
- Current Assignee Address: US TX Coppell
- Agency: Gardere Wynne Sewell LLP
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L21/768 ; H01L23/535 ; H01L29/66 ; H01L29/78 ; H01L29/423 ; H01L21/28 ; H01L29/49 ; H01L29/51

Abstract:
An integrated circuit includes a source-drain region, a channel region adjacent to the source-drain region, a gate structure extending over the channel region and a sidewall spacer on a side of the gate structure and which extends over the source-drain region. A dielectric layer is provided in contact with the sidewall spacer and having a top surface. The gate structure includes a gate electrode and a gate contact extending from the gate electrode as a projection to reach the top surface. The side surfaces of the gate electrode and a gate contact are aligned with each other. The gate dielectric layer for the transistor positioned between the gate electrode and the channel region extends between the gate electrode and the sidewall spacer and further extends between the gate contact and the sidewall spacer.
Public/Granted literature
Information query
IPC分类: