Invention Grant
- Patent Title: Semiconductor device having a gate all around structure and a method for fabricating the same
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Application No.: US14961213Application Date: 2015-12-07
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Publication No.: US09679965B1Publication Date: 2017-06-13
- Inventor: Sung Dae Suk , Bom-Soo Kim , Kang-Ill Seo
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/423 ; H01L29/78 ; H01L29/51 ; H01L29/417 ; H01L27/12

Abstract:
A semiconductor device includes a wire pattern spaced apart from a substrate and extended in a first direction, a gate electrode disposed around a circumference of the wire pattern and extended in a second direction that is different from the first direction, a source disposed on a first side of the gate electrode, a drain disposed on a second side of the gate electrode, the source and the drain connected to the wire pattern and a gate spacer disposed on first and second sidewalls of the gate electrode, on the source and on the drain.
Public/Granted literature
- US20170162651A1 SEMICONDUCTOR DEVICE HAVING A GATE ALL AROUND STRUCTURE AND A METHOD FOR FABRICATING THE SAME Public/Granted day:2017-06-08
Information query
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