An embodiment of this invention provides a separation apparatus for separating a stacked article, such as a semiconductor chip package with sensing functions, comprising a substrate and a cap layer formed on the substrate. The separation apparatus comprises a vacuum nozzle head including a suction pad having a top surface and a bottom surface, a through hole penetrating the top surface and the bottom surface of the suction pad, and a hollow vacuum pipe connecting the through hole to a vacuum pump; a stage positing under the vacuum nozzle head and substantially aligning with the suction pad; a control means coupling to the vacuum nozzle head to lift upward or lower down the vacuum nozzle head; and a first cutter comprising a first cutting body and a first knife connecting to the first cutting body. The cap layer is pressed against by the bottom surface of the suction pad and sucked by the suction pad of the vacuum nozzle head after the vacuum pump begins to vacuum the air within the hollow vacuum pipe and the through hole. Then, the first cutter cuts into the interface between the substrate and the cap layer, and the cap lay is separated from the substrate by the suction force of the vacuum nozzle head and the lift force generated by the upward movement of the vacuum nozzle head.