- 专利标题: Electronic device and manufacturing method therefor
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申请号: US13106933申请日: 2011-05-13
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公开(公告)号: US09685394B2公开(公告)日: 2017-06-20
- 发明人: Shigenobu Sekine , Yurina Sekine , Yoshiharu Kuwana
- 申请人: Shigenobu Sekine , Yurina Sekine , Yoshiharu Kuwana
- 申请人地址: JP Tokyo
- 专利权人: NAPRA CO., LTD.
- 当前专利权人: NAPRA CO., LTD.
- 当前专利权人地址: JP Tokyo
- 代理机构: Westerman, Hattori, Daniels & Adrian, LLP
- 优先权: JP2010-117008 20100521; JP2011-056556 20110315
- 主分类号: H01L33/62
- IPC分类号: H01L33/62 ; H01L21/28 ; H01L23/48 ; H01L21/768
摘要:
An electronic device includes a semiconductor substrate, an insulating material-filled layer and a vertical conductor. The semiconductor substrate has a vertical hole extending in a thickness direction thereof. The insulating material-filled layer is a ring-shaped layer filled in the vertical hole for covering an inner periphery thereof and includes an organic insulating material or an inorganic insulating material mainly of a glass and a nanocomposite ceramic. The nanocomposite ceramic has a specific resistance of greater than 1014 Ω·cm at room temperature and a relative permittivity of 4 to 9. The vertical conductor is a solidified metal body filled in an area surrounded by the insulating material-filled layer.
公开/授权文献
- US20110284912A1 ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR 公开/授权日:2011-11-24