Invention Grant
- Patent Title: Electronic device having circuit board as chassis
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Application No.: US14979320Application Date: 2015-12-22
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Publication No.: US09690322B1Publication Date: 2017-06-27
- Inventor: Hong W. Wong , Wah Yiu Kwong , Timothy T. Nguyen , Johnson Tao , Xiaoguo Liang
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: KED & Associates LLP
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H05K7/16 ; H05K5/02 ; H05K7/14 ; G06F1/18

Abstract:
An electronic device may be provided that includes a first housing. The first housing may include a plurality of electronic components, and a circuit board having a first surface and a second surface. At least one of the electronic components may be provided on the second surface of the circuit board. The circuit board may be configured as a chassis of the first housing.
Public/Granted literature
- US20170177027A1 ELECTRONIC DEVICE HAVING CIRCUIT BOARD AS CHASSIS Public/Granted day:2017-06-22
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