公开(公告)号：US09690322B1

公开(公告)日：2017-06-27

申请号：US14979320

申请日：2015-12-22

Applicant: INTEL CORPORATION

Inventor： Hong W. Wong ,  Wah Yiu Kwong ,  Timothy T. Nguyen ,  Johnson Tao ,  Xiaoguo Liang

IPC: G06F1/16 ,  H05K7/16 ,  H05K5/02 ,  H05K7/14 ,  G06F1/18

CPC classification number: G06F1/1616 ,  G06F1/163 ,  G06F1/1635 ,  G06F1/1637 ,  G06F1/1643 ,  G06F1/1656 ,  G06F1/1658 ,  G06F1/182 ,  G06F1/183 ,  G06F1/203

Abstract: An electronic device may be provided that includes a first housing. The first housing may include a plurality of electronic components, and a circuit board having a first surface and a second surface. At least one of the electronic components may be provided on the second surface of the circuit board. The circuit board may be configured as a chassis of the first housing.

公开(公告)号：US20170177027A1

公开(公告)日：2017-06-22

申请号：US14979320

申请日：2015-12-22

Applicant: INTEL CORPORATION

Inventor： Hong W. Wong ,  Wah Yiu Kwong ,  Timothy T. Nguyen ,  Johnson Tao ,  Xiaoguo Liang

IPC: G06F1/16 ,  H05K5/02 ,  H05K7/14 ,  H05K7/16

CPC classification number: G06F1/1616 ,  G06F1/163 ,  G06F1/1635 ,  G06F1/1637 ,  G06F1/1643 ,  G06F1/1656 ,  G06F1/1658 ,  G06F1/182 ,  G06F1/183 ,  G06F1/203

Abstract: An electronic device may be provided that includes a first housing. The first housing may include a plurality of electronic components, and a circuit board having a first surface and a second surface. At least one of the electronic components may be provided on the second surface of the circuit board. The circuit board may be configured as a chassis of the first housing.