Invention Grant
- Patent Title: Three-dimensional wire bond inductor
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Application No.: US14177620Application Date: 2014-02-11
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Publication No.: US09692386B2Publication Date: 2017-06-27
- Inventor: Chengjie Zuo , Mario Francisco Velez , Jonghae Kim , Daeik Daniel Kim , Changhan Hobie Yun
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Loza & Loza, LLP/Qualcomm
- Main IPC: H03H7/01
- IPC: H03H7/01 ; H01F27/28 ; H01L23/522
Abstract:
An inductor is provided on a substrate that includes a capacitor. The inductor comprises a series of wire loops. An end of the wire loop is wire bonded to the capacitor.
Public/Granted literature
- US20150180437A1 THREE-DIMENSIONAL WIRE BOND INDUCTOR Public/Granted day:2015-06-25
Information query
