Invention Grant
- Patent Title: Conductive cap for metal-gate transistor
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Application No.: US14661953Application Date: 2015-03-18
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Publication No.: US09698232B2Publication Date: 2017-07-04
- Inventor: Haining Yang , Stanley Seungchul Song
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Toler Law Group, PC
- Main IPC: H01L21/8234
- IPC: H01L21/8234 ; H01L29/49 ; H01L21/768 ; H01L21/28 ; H01L29/423 ; H01L29/51 ; H01L21/3213 ; H01L23/528 ; H01L23/532 ; H01L29/06 ; H01L29/66 ; H01L29/78

Abstract:
A semiconductor device includes a gate region, a conductive cap, and an interconnect. The gate region (e.g., a metal-gate transistor) includes a metal gate region and a high dielectric constant (high-K) gate dielectric region. The conductive cap is disposed on a surface of the metal gate region and on a surface of the high-K gate dielectric region, and the interconnect is disposed on the conductive cap. The conductive cap includes a conductive material that electrically connects the gate region to the interconnect.
Public/Granted literature
- US20160276455A1 CONDUCTIVE CAP FOR METAL-GATE TRANSISTOR Public/Granted day:2016-09-22
Information query
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