Invention Grant
- Patent Title: Printed circuit board and manufacturing method thereof
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Application No.: US15084864Application Date: 2016-03-30
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Publication No.: US09706644B2Publication Date: 2017-07-11
- Inventor: Sung-Han Kim , Han Kim , Mi-Sun Hwang , Sang-Yul Ha , Seok-Hwan Ahn , Kyung-Ho Lee
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2015-0116924 20150819
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/00 ; H05K1/02 ; H05K3/10 ; H05K3/00 ; H05K3/46
Abstract:
A printed circuit board and a method of manufacturing the same is provided. The printed circuit board includes an insulating substrate, a circuit disposed on the insulating substrate, a pair of first reinforcements spatially separated in the insulating substrate, the first reinforcements extending parallel to a surface of the insulating substrate, and a second reinforcement configured to connect the pair of first reinforcements.
Public/Granted literature
- US20170055345A1 PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF Public/Granted day:2017-02-23
Information query
