公开(公告)号：US09706644B2

公开(公告)日：2017-07-11

申请号：US15084864

申请日：2016-03-30

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Sung-Han Kim ,  Han Kim ,  Mi-Sun Hwang ,  Sang-Yul Ha ,  Seok-Hwan Ahn ,  Kyung-Ho Lee

IPC: H05K1/11 ,  H05K1/00 ,  H05K1/02 ,  H05K3/10 ,  H05K3/00 ,  H05K3/46

CPC classification number: H05K1/0271 ,  H05K3/0017 ,  H05K3/4682 ,  H05K2201/09781 ,  H05K2201/098 ,  H05K2201/2009

Abstract: A printed circuit board and a method of manufacturing the same is provided. The printed circuit board includes an insulating substrate, a circuit disposed on the insulating substrate, a pair of first reinforcements spatially separated in the insulating substrate, the first reinforcements extending parallel to a surface of the insulating substrate, and a second reinforcement configured to connect the pair of first reinforcements.