Invention Grant
- Patent Title: Via in a printed circuit board
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Application No.: US15001140Application Date: 2016-01-19
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Publication No.: US09706667B2Publication Date: 2017-07-11
- Inventor: Konstantine Karavakis , Kenneth S. Bahl
- Applicant: SIERRA CIRCUITS, INC.
- Applicant Address: US CA Sunnyvale
- Assignee: SIERRA CIRCUITS, INC.
- Current Assignee: SIERRA CIRCUITS, INC.
- Current Assignee Address: US CA Sunnyvale
- Agent Douglas L Weller
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K3/38 ; H05K3/42
Abstract:
A via in a printed circuit board is composed of a patterned metal layer that extends through a hole in dielectric laminate material. A layer of catalytic adhesive coats walls within the hole. The patterned metal layer is placed over the catalytic adhesive within the hole.
Public/Granted literature
- US20160135297A1 VIA IN A PRINTED CIRCUIT BOARD Public/Granted day:2016-05-12
Information query
