Invention Grant
- Patent Title: Fluid directing assembly
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Application No.: US15111148Application Date: 2014-01-29
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Publication No.: US09707766B2Publication Date: 2017-07-18
- Inventor: Sterling Chaffins , Kevin P. DeKam , Chien-Hua Chen
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Inc.—Patent Department
- International Application: PCT/US2014/013538 WO 20140129
- International Announcement: WO2015/116059 WO 20150806
- Main IPC: B41J2/175
- IPC: B41J2/175 ; B29B11/06 ; B41J2/015 ; B41J2/16 ; B41J2/14

Abstract:
A fluid directing assembly can comprise a molded support comprising a modified epoxy molded compound which includes epoxy resin, cross-linker, filler, and is devoid of wax release agent. The assembly can also include a silicon die attached to the molded support and wherein the silicon die and the molded support define a fluid directing channel.
Public/Granted literature
- US20160332450A1 FLUID DIRECTING ASSEMBLY Public/Granted day:2016-11-17
Information query
IPC分类: