- 专利标题: Seed layer deposition in microscale features
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申请号: US12755198申请日: 2010-04-06
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公开(公告)号: US09714474B2公开(公告)日: 2017-07-25
- 发明人: Arthur Keigler , Johannes Chiu , Zhenqiu Liu , Daniel Goodman
- 申请人: Arthur Keigler , Johannes Chiu , Zhenqiu Liu , Daniel Goodman
- 申请人地址: US MA Billerica
- 专利权人: TEL NEXX, INC.
- 当前专利权人: TEL NEXX, INC.
- 当前专利权人地址: US MA Billerica
- 代理机构: Rothwell, Figg, Ernst & Manbeck, P.C.
- 主分类号: C25D7/12
- IPC分类号: C25D7/12 ; H01L21/288 ; H01L21/768 ; C25D17/00
摘要:
A method and system for coating the interior surfaces of microscale hole features fabricated into the substantially planar surface of a work piece. The method comprises providing a work piece with a barrier metal coating that is substantially continuous and uniform both along the planar surface of the work piece and the inner surfaces of the microscale hole features wherein said barrier metal coating is applied by a substantially surface reaction limited process. The workpiece is provided with a coating, on the planar surface of the work piece, of a thick metal layer anchored to the barrier metal coat and disposed to provide substantially uniform electrical conduction capability to the microscale features located throughout and across the workpiece. An electrical contact path is provided to the electrically conductive coating at the perimeter of the work piece. The workpiece is immersed in a chemical bath, causing said chemical bath to fully contact the interior surfaces of the microscale hole features, said chemical bath containing metal ions suitable for electrodeposition. An electric potential is applied at the perimeter of the work piece to cause electrodeposition of metal ions onto all surfaces of the work piece including the interior surfaces of the microscale hole features to a predetermined finish coating in one step.
公开/授权文献
- US20110240481A1 SEED LAYER DEPOSITION IN MICROSCALE FEATURES 公开/授权日:2011-10-06
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