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公开(公告)号：US20110240481A1
公开(公告)日：2011-10-06
申请号：US12755198
申请日：2010-04-06
申请人： Arthur Keigler , Johannes Chiu , Zhenqiu Liu , Daniel Goodman
发明人： Arthur Keigler , Johannes Chiu , Zhenqiu Liu , Daniel Goodman
CPC分类号： C25D7/123 , C25D17/001 , H01L21/2885 , H01L21/76873 , H01L21/76898 , H01L2221/1089
摘要： A method and system for coating the interior surfaces of microscale hole features fabricated into the substantially planar surface of a work piece. The method comprises providing a work piece with a barrier metal coating that is substantially continuous and uniform both along the planar surface of the work piece and the inner surfaces of the microscale hole features wherein said barrier metal coating is applied by a substantially surface reaction limited process. The workpiece is provided with a coating, on the planar surface of the work piece, of a thick metal layer anchored to the barrier metal coat and disposed to provide substantially uniform electrical conduction capability to the microscale features located throughout and across the workpiece. An electrical contact path is provided to the electrically conductive coating at the perimeter of the work piece. The workpiece is immersed in a chemical bath, causing said chemical bath to fully contact the interior surfaces of the microscale hole features, said chemical bath containing metal ions suitable for electrodeposition. An electric potential is applied at the perimeter of the work piece to cause electrodeposition of metal ions onto all surfaces of the work piece including the interior surfaces of the microscale hole features to a predetermined finish coating in one step.
摘要翻译： 一种用于涂覆微孔孔特征的内表面的方法和系统，其制造成工件的基本平坦的表面。 该方法包括提供具有阻挡金属涂层的工件，所述阻挡金属涂层沿着工件的平坦表面和微孔特征的内表面基本上连续且均匀，其中所述阻挡金属涂层通过基本上表面反应限制的工艺 。 工件在工件的平坦表面上设置有锚固到阻挡金属涂层的厚金属层并且设置成为位于整个和跨过工件的微尺度特征提供基本均匀的导电能力的涂层。 在工件周边处的导电涂层上提供电接触路径。 将工件浸入化学浴中，使所述化学浴与微孔特征的内表面完全接触，所述化学浴含有适合于电沉积的金属离子。 在工件的周边施加电势，使金属离子在工件的所有表面上电沉积，包括微孔孔特征的内表面到一个步骤中的预定的涂层。
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公开(公告)号：US09714474B2
公开(公告)日：2017-07-25
申请号：US12755198
申请日：2010-04-06
申请人： Arthur Keigler , Johannes Chiu , Zhenqiu Liu , Daniel Goodman
发明人： Arthur Keigler , Johannes Chiu , Zhenqiu Liu , Daniel Goodman
IPC分类号： C25D7/12 , H01L21/288 , H01L21/768 , C25D17/00
CPC分类号： C25D7/123 , C25D17/001 , H01L21/2885 , H01L21/76873 , H01L21/76898 , H01L2221/1089
摘要： A method and system for coating the interior surfaces of microscale hole features fabricated into the substantially planar surface of a work piece. The method comprises providing a work piece with a barrier metal coating that is substantially continuous and uniform both along the planar surface of the work piece and the inner surfaces of the microscale hole features wherein said barrier metal coating is applied by a substantially surface reaction limited process. The workpiece is provided with a coating, on the planar surface of the work piece, of a thick metal layer anchored to the barrier metal coat and disposed to provide substantially uniform electrical conduction capability to the microscale features located throughout and across the workpiece. An electrical contact path is provided to the electrically conductive coating at the perimeter of the work piece. The workpiece is immersed in a chemical bath, causing said chemical bath to fully contact the interior surfaces of the microscale hole features, said chemical bath containing metal ions suitable for electrodeposition. An electric potential is applied at the perimeter of the work piece to cause electrodeposition of metal ions onto all surfaces of the work piece including the interior surfaces of the microscale hole features to a predetermined finish coating in one step.
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公开(公告)号：US20120152752A1
公开(公告)日：2012-06-21
申请号：US12971744
申请日：2010-12-17
申请人： Arthur Keigler , Johannes Chiu , Zhenqiu Liu , Daniel Goodman
发明人： Arthur Keigler , Johannes Chiu , Zhenqiu Liu , Daniel Goodman
CPC分类号： C25D5/02 , C25D5/10 , C25D5/50 , H01L24/11 , H01L2224/11462 , H01L2224/11502 , H01L2224/11849 , H01L2224/11901 , H01L2924/01322 , H01L2924/14 , H01L2924/00 , H01L2224/1146
摘要： A method of forming a metal feature on a workpiece with deposition is provided. The method includes providing an under bump metal layer for solder of an electronic device on the workpiece, depositing a substantially pure tin layer directly to the under bump metal layer, and depositing a tin silver alloy layer onto the substantially pure tin layer.
摘要翻译： 提供了一种在沉积工件上形成金属特征的方法。 该方法包括在工件上提供用于焊接电子器件的凸块下金属层，将基本上纯的锡层直接沉积到凸块下金属层上，并将锡银合金层沉积到基本上纯的锡层上。
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公开(公告)号：US09017528B2
公开(公告)日：2015-04-28
申请号：US13445217
申请日：2012-04-12
CPC分类号： C25D21/22 , C25D17/001 , C25D17/002 , C25D17/06 , C25D21/10
摘要： A process electrolyte replenishment module adapted to replenish ions in a process electrolyte in a substrate electrochemical deposition apparatus having a first anode and a first cathode, the replenishment module having a second anode. A process electrolyte recirculation compartment is disposed in the frame configured so that the process electrolyte is recirculating between the replenishment module and the deposition apparatus. An anode compartment is coupled to the process electrolyte recirculation compartment having the second anode, that is a soluble anode, for immersion in a secondary anolyte, and having a first ion exchange membrane being a cationic member separating the secondary anolyte from the process electrolyte. A cathode compartment is provided in the frame coupled to the process electrolyte recirculation compartment having a second cathode for immersion in a secondary catholyte, and having a second ion exchange membrane being a monovalent selective membrane separating the secondary catholyte from the process electrolyte.
摘要翻译： 一种适用于在具有第一阳极和第一阴极的基板电化学沉积设备中补充处理电解质中的离子的过程电解质补充模块，所述补充模块具有第二阳极。 处理电解质再循环隔室设置在框架中，其被构造成使得处理电解质在补充模块和沉积设备之间循环。 阳极室耦合到具有第二阳极（即可溶性阳极）的工艺电解质再循环室，用于浸渍在次级阳极液中，并且具有第一离子交换膜是将次级阳极液与工艺电解质分离的阳离子构件。 阴极室设置在耦合到处理电解质再循环隔间的框架中，该隔室具有用于浸入次级阴极电解液中的第二阴极，并且具有第二离子交换膜是将次级阴极电解液与工艺电解质分开的一价选择膜。
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公开(公告)号：US20120298504A1
公开(公告)日：2012-11-29
申请号：US13445457
申请日：2012-04-12
IPC分类号： C25B9/08
CPC分类号： C25D21/22 , C25D7/123 , C25D17/001 , C25D17/002
摘要： An electrochemical deposition apparatus adapted to deposit metal onto a surface of a substrate, the apparatus has a frame configured for holding a process electrolyte. A substrate holder is removably coupled to the frame, the substrate holder supporting the substrate in the process electrolyte. An anode fluid compartment is removably coupled to the frame and containing an anolyte and having an anode facing the surface of the substrate, the anode fluid compartment further having a ion exchange membrane disposed between the anode and the surface of the substrate, the anode fluid compartment removable from the frame as a unit with the ion exchange membrane and the anode. The holder, the anode and the membrane are arranged in the frame so that ions from the anode pass through the ion exchange membrane into and primarily replenish ions in the process electrolyte depleted by ion deposition onto the surface of the substrate.
摘要翻译： 一种适于将金属沉积在基底表面上的电化学沉积装置，该装置具有构造成保持工艺电解质的框架。 衬底保持器可移除地联接到框架，衬底保持器将衬底支撑在处理电解质中。 阳极流体隔室可拆卸地联接到框架并且包含阳极电解液并且具有面向基底表面的阳极，阳极流体隔室还具有设置在阳极和基底表面之间的离子交换膜，阳极流体隔室 作为与离子交换膜和阳极的单元从框架中移除。 保持器，阳极和膜被布置在框架中，使得来自阳极的离子通过离子交换膜进入并且主要补充通过离子沉积耗尽的工艺电解质中的离子到衬底的表面上。
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公开(公告)号：US09005409B2
公开(公告)日：2015-04-14
申请号：US13445457
申请日：2012-04-12
CPC分类号： C25D21/22 , C25D7/123 , C25D17/001 , C25D17/002
摘要： An electrochemical deposition apparatus adapted to deposit metal onto a surface of a substrate, the apparatus has a frame configured for holding a process electrolyte. A substrate holder is removably coupled to the frame, the substrate holder supporting the substrate in the process electrolyte. An anode fluid compartment is removably coupled to the frame and containing an anolyte and having an anode facing the surface of the substrate, the anode fluid compartment further having a ion exchange membrane disposed between the anode and the surface of the substrate, the anode fluid compartment removable from the frame as a unit with the ion exchange membrane and the anode. The holder, the anode and the membrane are arranged in the frame so that ions from the anode pass through the ion exchange membrane into and primarily replenish ions in the process electrolyte depleted by ion deposition onto the surface of the substrate.
摘要翻译： 一种适于将金属沉积在基底表面上的电化学沉积装置，该装置具有构造成保持工艺电解质的框架。 衬底保持器可移除地联接到框架，衬底保持器将衬底支撑在处理电解质中。 阳极流体隔室可拆卸地联接到框架并且包含阳极电解液并且具有面向基底表面的阳极，阳极流体隔室还具有设置在阳极和基底表面之间的离子交换膜，阳极流体隔室 作为与离子交换膜和阳极的单元从框架中移除。 保持器，阳极和膜被布置在框架中，使得来自阳极的离子通过离子交换膜进入并且主要补充通过离子沉积耗尽的工艺电解质中的离子到衬底的表面上。
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公开(公告)号：US20120298502A1
公开(公告)日：2012-11-29
申请号：US13445217
申请日：2012-04-12
IPC分类号： C25B15/08
CPC分类号： C25D21/22 , C25D17/001 , C25D17/002 , C25D17/06 , C25D21/10
摘要： A process electrolyte replenishment module adapted to replenish ions in a process electrolyte in a substrate electrochemical deposition apparatus having a first anode and a first cathode, the replenishment module having a second anode. A process electrolyte recirculation compartment is disposed in the frame configured so that the process electrolyte is recirculating between the replenishment module and the deposition apparatus. An anode compartment is coupled to the process electrolyte recirculation compartment having the second anode, that is a soluble anode, for immersion in a secondary anolyte, and having a first ion exchange membrane being a cationic member separating the secondary anolyte from the process electrolyte. A cathode compartment is provided in the frame coupled to the process electrolyte recirculation compartment having a second cathode for immersion in a secondary catholyte, and having a second ion exchange membrane being a monovalent selective membrane separating the secondary catholyte from the process electrolyte.
摘要翻译： 一种适用于在具有第一阳极和第一阴极的基板电化学沉积设备中补充处理电解质中的离子的过程电解质补充模块，所述补充模块具有第二阳极。 处理电解质再循环隔室设置在框架中，其被构造成使得处理电解质在补充模块和沉积设备之间循环。 阳极室耦合到具有第二阳极（即可溶性阳极）的工艺电解质再循环室，用于浸渍在次级阳极液中，并且具有第一离子交换膜是将次级阳极液与工艺电解质分离的阳离子构件。 阴极室设置在耦合到处理电解质再循环隔间的框架中，该隔室具有用于浸入次级阴极电解液中的第二阴极，并且具有第二离子交换膜是将次级阴极电解液与工艺电解质分开的一价选择膜。
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