Invention Grant
- Patent Title: Memory cell having dielectric memory element
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Application No.: US13906964Application Date: 2013-05-31
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Publication No.: US09721655B2Publication Date: 2017-08-01
- Inventor: Jun Liu
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01L47/00
- IPC: H01L47/00 ; G11C13/00 ; G11C11/56 ; H01L27/102 ; H01L27/24 ; H01L45/00

Abstract:
Some embodiments include apparatus and methods having a memory cell with a first electrode, a second electrode, and a dielectric located between the first and second electrodes. The dielectric may be configured to allow the memory cell to form a conductive path in the dielectric from a portion of a material of the first electrode to represent a first value of information stored in the memory cell. The dielectric may also be configured to allow the memory cell to break the conductive path to represent a second value of information stored in the memory cell.
Public/Granted literature
- US20130265822A1 MEMORY CELL HAVING DIELECTRIC MEMORY ELEMENT Public/Granted day:2013-10-10
Information query
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