The present disclosure relates to a semiconductor package and method of making the same. The semiconductor package includes an encapsulation layer, a dielectric layer, a component, and a first patterned conductive layer. The encapsulation layer has a first surface. The component is within the encapsulation layer and has a front surface and a plurality of pads on the front surface. The dielectric layer is on the first surface of the encapsulation layer, and defines a plurality of via holes; wherein the plurality of pads of the component are against the dielectric layer; and wherein the dielectric layer has a second surface opposite the first surface of the encapsulation layer. Each of plurality of via holes extends from the second surface of the dielectric layer to a respective one of the plurality of the pads. The first patterned conductive layer is within the dielectric layer and surrounds the via holes.