Provided is a thermal flow meter that can be prevented from being eroded due to adhesion of water or like to a cut end portion of the lead exposed from the mold resin of the circuit package. A thermal flow meter 300 of the present invention is a thermal flow meter having a circuit package 400 formed by mounting a detection element 518 on leads 544 and 545 supported by a support frame 512, sealing with a mold resin, and cutting off the support frame 512, wherein cut end portions 544a and 545a of the leads 544 and 545 exposed from the mold resin of the circuit package 400 by cutting off the support frame 512 is covered by a covering portion 371.