Invention Grant
- Patent Title: Polishing compositions and methods for polishing cobalt films
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Application No.: US14478508Application Date: 2014-09-05
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Publication No.: US09735030B2Publication Date: 2017-08-15
- Inventor: Luling Wang , Abhudaya Mishra , Deepak Mahulikar , Richard Wen
- Applicant: Fujifilm Planar Solutions, LLC
- Applicant Address: US RI North Kingstown
- Assignee: FUJIFILM PLANAR SOLUTIONS, LLC
- Current Assignee: FUJIFILM PLANAR SOLUTIONS, LLC
- Current Assignee Address: US RI North Kingstown
- Agency: Ohlandt, Greeley, Ruggiero & Perle, LLP
- Main IPC: B44C1/22
- IPC: B44C1/22 ; C03C15/00 ; C03C25/68 ; C23F1/00 ; H01L21/321 ; C09G1/02
Abstract:
The present disclosure relates to polishing compositions that can polish Cobalt (Co) films in semiconductor substrates containing a multitude of films including Co, metals, metal oxides and dielectrics. These polishing compositions comprise an abrasive, a weak acid acting as a removal rate enhancer (RRE), a pH adjuster, and an azole-containing corrosion inhibitor (CI). The RRE, pH adjuster and CI have a pKa in the 1-18 range (1 (pKamin)
Public/Granted literature
- US20160068710A1 POLISHING COMPOSITIONS AND METHODS FOR POLISHING COBALT FILMS Public/Granted day:2016-03-10
Information query
