- Patent Title: Device including multiple semiconductor chips and multiple carriers
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Application No.: US14254139Application Date: 2014-04-16
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Publication No.: US09735078B2Publication Date: 2017-08-15
- Inventor: Ralf Otremba , Klaus Schiess , Oliver Haeberlen , Matteo-Alessandro Kutschak
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/48 ; H01L23/52 ; H01L23/31 ; H01L25/10 ; H01L23/00 ; H01L23/14 ; H01L21/48 ; H01L23/538 ; H01L21/56
Abstract:
A device includes a first semiconductor chip that is arranged over a first carrier and includes a first electrical contact. The device further includes a second semiconductor chip arranged over a second carrier and including a second electrical contact arranged over a surface of the second semiconductor chip facing the second carrier. The second carrier is electrically coupled to the first electrical contact and the second electrical contact.
Public/Granted literature
- US20150303128A1 Device Including Multiple Semiconductor Chips and Multiple Carriers Public/Granted day:2015-10-22
Information query
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