Invention Grant
- Patent Title: Structures and methods for reliable packages
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Application No.: US14749529Application Date: 2015-06-24
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Publication No.: US09741620B2Publication Date: 2017-08-22
- Inventor: Cyprian Emeka Uzoh , Guilian Gao , Liang Wang , Hong Shen , Arkalgud R. Sitaram
- Applicant: Invensas Corporation
- Applicant Address: US CA San Jose
- Assignee: INVENSAS CORPORATION
- Current Assignee: INVENSAS CORPORATION
- Current Assignee Address: US CA San Jose
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/70 ; H01L21/82 ; H01L21/56 ; H01L23/00 ; H01L21/48 ; H01L23/538 ; H01L23/31
Abstract:
A device and method of forming the device that includes cavities formed in a substrate of a substrate device, the substrate device also including conductive vias formed in the substrate. Chip devices, wafers, and other substrate devices can be mounted to the substrate device. Encapsulation layers and materials may be formed over the substrate device in order to fill the cavities.
Public/Granted literature
- US20160379885A1 STRUCTURES AND METHODS FOR RELIABLE PACKAGES Public/Granted day:2016-12-29
Information query
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