Invention Grant
- Patent Title: Printed circuit module having semiconductor device with a polymer substrate and methods of manufacturing the same
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Application No.: US14851652Application Date: 2015-09-11
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Publication No.: US09741632B2Publication Date: 2017-08-22
- Inventor: Dirk Robert Walter Leipold , Julio C. Costa , Baker Scott
- Applicant: RF Micro Devices, Inc.
- Applicant Address: US NC Greensboro
- Assignee: Qorvo US, Inc.
- Current Assignee: Qorvo US, Inc.
- Current Assignee Address: US NC Greensboro
- Agency: Withrow & Terranova, P.L.L.C.
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/29 ; H01L23/367 ; H01L23/373 ; H01L21/311 ; H01L21/3105 ; H01L21/683 ; H01L21/02 ; H01L21/56 ; H01L21/762
Abstract:
A printed circuit module and methods for manufacturing the same are disclosed. The printed circuit module includes a printed circuit substrate with a thinned die attached to the printed circuit substrate. The thinned die includes at least one device layer over the printed circuit substrate and a buried oxide (BOX) layer over the at least one device layer. A polymer layer is disposed over the BOX layer, wherein the polymer has a thermal conductivity greater than 2 watts per meter Kelvin (W/mK) and an electrical resistivity of greater than 103 Ohm-cm.
Public/Granted literature
Information query
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