Invention Grant
- Patent Title: Automatic height compensating and co-planar leveling heat removal assembly for multi-chip packages
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Application No.: US14861892Application Date: 2015-09-22
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Publication No.: US09743558B2Publication Date: 2017-08-22
- Inventor: Henry C. Bosak , Thomas A. Boyd , Harvey R. Kofstad
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L23/427
- IPC: H01L23/427 ; H05K7/20 ; H01L23/40 ; H01L23/473 ; H01L25/065 ; H01L23/367
Abstract:
Embodiments of the present disclosure may include a heat removal assembly that is to thermally couple with two or more dice of an electronic device. The heat removal assembly may include a bellows to automatically adjust a position of at least one surface of the heat removal assembly relative to another surface of the heat removal assembly. Other embodiments may be described and/or claimed.
Public/Granted literature
- US20160106003A1 AUTOMATIC HEIGHT COMPENSATING AND CO-PLANAR LEVELING HEAT REMOVAL ASSEMBLY FOR MULTI-CHIP PACKAGES Public/Granted day:2016-04-14
Information query
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